| 发明名称 |
SERVER WITH HEAT PIPE COOLING |
| 摘要 |
A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed between the motherboard and the fan and the hard drive is operatively connected to the motherboard. The server also includes a heat pipe that has a body longitudinally bounded by an inlet and an outlet. The inlet is coupled to the heat sink, while the outlet is coupled to the fan. The body of the heat pipe extends past the hard drive. A power supply is also disposed in the tray and is operatively connected to the motherboard, the fan, and the hard drive. |
| 申请公布号 |
US2017017278(A1) |
申请公布日期 |
2017.01.19 |
| 申请号 |
US201615215009 |
申请日期 |
2016.07.20 |
| 申请人 |
SILICON GRAPHICS INTERNATIONAL CORP. |
发明人 |
Kinstle Robert Michael;Schlichter Kevin;Barron Seitu |
| 分类号 |
G06F1/20;H05K7/20 |
主分类号 |
G06F1/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A server, comprising:
a tray having a front portion and a back portion; a motherboard disposed in the front portion of the tray, the motherboard coupled to a heat sink; a fan disposed in the back portion of the tray; a hard drive disposed between the motherboard and the fan, the hard drive operatively connected to the motherboard; a heat pipe having a body longitudinally bounded by an inlet and an outlet, the inlet coupled to the heat sink, the outlet coupled to the fan, and the body extending past the hard drive; and a power supply disposed in the tray, the power supply operatively connected to the motherboard, the fan, and the hard drive. |
| 地址 |
MILPITAS CA US |
