发明名称 ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
摘要 Provided is a thermpolymerizable anisotropic conductive film having a structure in which an intermediate layer is sandwiched and held between an insulating base layer and an adhesive layer, and conductive particles are retained in any of these layers. The intermediate layer and the adhesive layer each have a melt viscosity that is higher than the melt viscosity of the insulating base layer. When the anisotropic conductive film is viewed in plan view, conductive particles are present in a mutually independently manner. The entire anisotropic conductive film that has undergone thermopolymerization has a modulus of greater than 1800 MPa at 100°C.
申请公布号 WO2017010446(A1) 申请公布日期 2017.01.19
申请号 WO2016JP70391 申请日期 2016.07.11
申请人 DEXERIALS CORPORATION 发明人 TSUKAO, Reiji;MIYAKE, Takeshi
分类号 H01R11/01;H01B5/16 主分类号 H01R11/01
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