| 摘要 |
The purpose of the present invention is to provide a wiring substrate that, when a light-transmissive section is formed therein, inhibits the occurrence of a crack in a base material, has high light transmittance, and allows formation of micro wiring, as well as a method for manufacturing the same. A wiring substrate according to the present invention is provided with: a base material having light transmittance; a laminate formed by laminating a metal layer and a resin layer on at least one side of the base material; and a light-transmissive section in the form of an opening provided in a part of the laminate. The wiring substrate is characterized in that at least a part of the lateral surface defining the light-transmissive section is formed of the resin layer and that, in the vicinity of the front surface of the base material, a part of the metal layer is disposed so as to neighbor the resin layer constituting the at least part of the lateral surface defining the light-transmissive section and to surround that resin layer. |
