RELEASABLE CARRIER AND METHOD

摘要

Disclosed herein is a releasable carrier that includes a supporting carrier, a carrier conductive layer, and a releasable tape located between the supporting carrier and the carrier conductive layer. The releasable tape attaches the supporting carrier to the carrier conductive layer. The releasable tape is configured to release the supporting carrier from the carrier conductive layer after being exposed to an activating source. The releasable carrier further includes a thin conductive layer attached to the carrier conductive layer, the thin conductive layer creating a surface configured to receive a conductive circuit. Further disclosed is a method for fabricating the releasable carrier and a method for making a semiconductor device using the releasable carrier.

主权项

1. A method for making a semiconductor device comprising:
providing a releasable carrier attached to a conductive layer; patterning a conductive circuit on a surface of the conductive layer; applying an insulative material at least partially covering the conductive circuit; releasing the releasable carrier from the conductive layer; and facilitating the releasing with an activating source.