发明名称 光半導体装置及び光半導体装置の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a white curable composition for an optical semiconductor device where migration hardly occurs at a metal part in the optical semiconductor device which includes a compact obtained by molding of the white curable composition for the optical semiconductor device.SOLUTION: A white curable composition for an optical semiconductor contains an epoxy compound, a curative agent, a titanium oxide, a filler different from the titanium oxide, a hardening accelerator, and an antioxidant. A molecular mass of the antioxidant is 600 or larger and less than 2000. Constituent atoms of the antioxidant are only three kinds, a carbon atom, an oxygen atom, and a hydrogen atom.SELECTED DRAWING: Figure 1
申请公布号 JP6061471(B2) 申请公布日期 2017.01.18
申请号 JP20120010867 申请日期 2012.01.23
申请人 積水化学工業株式会社 发明人 鹿毛 崇至;樋口 勲夫;中村 秀;谷川 満;渡邉 貴志
分类号 H01L33/56;C08G59/20;C08K3/22;C08L63/00;H01L23/29;H01L23/31 主分类号 H01L33/56
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