| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problem: In arranging a power semiconductor module on a heat sink, the arrangement has conventionally produced a bottleneck of space saving because the arrangement requires a connection member for selectively performing conduction and insulation.SOLUTION: Of a P electrode, an N electrode and an AC electrode of a power semiconductor module, the N electrode is set at a GND potential and the N electrode is exposed from the power semiconductor module and brought into contact with a heat sink.SELECTED DRAWING: Figure 1 |
