| 摘要 |
PURPOSE:To provide a multilayer interconnection ceramic board having a large mechanical proof stress, wherein the effective dielectric constant of its dielectric part can be reduced even when using an ordinary ceramic material. CONSTITUTION:In second and third ceramic boards 1B, 1C, through holes 2 whose axes are respectively vertical to the width spread surfaces of these ceramic boards are bored at adequate spaces. Into most ones of the foregoing through holes 2, volatile pastes 4 are filled, and a first-fourth ceramic boards 1A-1D are laminated in this order. Then, by heating these boards, the volatile pastes 4 are volatilized to the outside, and hollow parts 8A-8D are formed. Thereby, the effective dielectric constants of the parts of the ceramic board, which are laid respectively between ground conductors 6B and 6A and between ground conductors 6C and 6A, are reduced. |
