发明名称 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
摘要 The invention provides a phtotocuring thermocuring resin composition, a dry film and cured resin thereof, and a printed circuit board formed by making the dry film and the cured resin form a cured epitheliuma, such as a solder mask. The phtotocuring thermocuring resin composition is a 1 hydrothermal resin compositon; the dry film is good in storage and stability at room temperature, and is also good at developing performance, resistance to soldering heat performance, insulation reliability, and gold-plating resistance performance; the phtotocuring thermocuring resin composition can be stored at room temperature and comprises carboxyl resin, photopolymerization initiator and plant origin epoxide. Preferably, teh acid value of the carboxyl resin is 30 to 150mgKOH/g, and the preference is given to the photopolymerization group, especially the olefinic unsaturated group; and as the plant origin epoxide, the preference is given to the epoxy soybean oil and the epoxy linseed oil.
申请公布号 JP6061449(B2) 申请公布日期 2017.01.18
申请号 JP20110078109 申请日期 2011.03.31
申请人 太陽インキ製造株式会社 发明人 岡本 大地;伊藤 信人;有馬 聖夫
分类号 G03F7/004;C08F290/00;C08G59/20;G03F7/038;H05K3/28 主分类号 G03F7/004
代理机构 代理人
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