发明名称 半導体装置およびその製造方法
摘要 PROBLEM TO BE SOLVED: To relax concentration of injection charge to inhibit breakage of an element.SOLUTION: A semiconductor device comprises a p-type deep layer 18 which has contact with a p-type high-impurity layer 10 and a p-type column 4a and which is arranged so as to overlap between an end P1 to an end of the p-type high-impurity layer 10 when viewed from above the semiconductor device. In addition, a p-type impurity concentration of the p-type deep layer 18 is made higher than that of a p-type layer 5 and lower than that of the p-type high-impurity layer 10. By providing such p-type deep layer 18, concentration of injection charge at the time of a recovery operation can be relaxed and breakage of an element can be inhibited.
申请公布号 JP6062340(B2) 申请公布日期 2017.01.18
申请号 JP20130214758 申请日期 2013.10.15
申请人 株式会社デンソー 发明人 利田 祐麻;赤木 望;林 敬太
分类号 H01L29/78;H01L21/329;H01L21/336;H01L29/06;H01L29/861;H01L29/868 主分类号 H01L29/78
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