发明名称 プラズマ処理容器及びプラズマ処理装置
摘要 The invention provides a plasma processing container and a plasma processing device. In a plasma processing device taking an inductive coupling plasma processing device as the primary, the deformation of a cover part caused by heating can be suppressed. The connection part of a main body container (2A) and an upper container (2B) of the inductive coupling plasma processing device (1) is provided with an O-shaped ring (51), a heat insulation part (52), and a winding shielding part (53) all over the periphery. The heat insulation part (52) is embedded into the groove (62) for the heat insulation part (52) which includes a plurality of long-strip shaped heat insulation plates (54). A clearance (CL) is arranged between the main body container (2A) and the upper container (2B) by means of the heat insulation part (52). The heat insulation part (52) makes the main body container (2A) and the upper container (2B) thermally isolate, the deformation amount can be absorbed even though the upper container (2B) deforms because of heat.
申请公布号 JP6063741(B2) 申请公布日期 2017.01.18
申请号 JP20120288053 申请日期 2012.12.28
申请人 東京エレクトロン株式会社 发明人 笠原 稔大
分类号 H01L21/3065;C23C16/505;H01L21/205;H01L21/31;H05H1/46 主分类号 H01L21/3065
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