| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component in which deterioration in reliability of electrical and mechanical connection is suppressed.SOLUTION: The electronic component includes an electronic substrate (10), a multilayer substrate (30), and a conductive member (50) connecting them. The electronic substrate includes a substrate (11) and an electrode (12) formed on that surface (11a) of the substrate which faces the multilayer substrate. The multilayer substrate includes an insulating layer (31), internal wiring (32) formed inside the insulating layer, external wiring (33) formed outside the insulating layer, and a via (34) connecting the internal wiring and the external wiring. The conductive member is formed by vaporization of a solvent contained in a conductive paste. The electrode and the external wiring are connected via the conductive member. A recess (35) which is locally recessed is formed on the external wiring in order to secure the thickness of the conductive member. The depth (T2) of the recess is shallower than the thickness (T1) of the external wiring in a thickness direction orthogonal to that surface of the substrate which faces the multilayer substrate. |
