| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of detecting a second cut groove formed in the region of a first cut groove efficiently.SOLUTION: Position of a second cut groove (42) is detected while a step of forming a first cut groove (41) in a wafer (W) by a first cutting means (27), and a step and forming a second cut groove (42) narrower than the first cut groove (41) by a second cutting means (28) along the first cut groove (41) are performed. When the position is detected, the first cutting means (27) is elevated at the outer periphery of the wafer (W) during formation of the first cut groove (41), and a non-cut region (50) is left on the surface of the wafer (W). Subsequently, the non-cut region (50) is cut by a second cutting means (48), the second cutting means (48) exposed to the surface of the non-cut region (50) is imaged by second imaging means (44), and then positional relationship of the second imaging means (44) with a reference line is detected. |
