PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
摘要
A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
申请公布号
EP3119169(A1)
申请公布日期
2017.01.18
申请号
EP20150181783
申请日期
2015.08.20
申请人
LG Innotek Co., Ltd.
发明人
BAE, Yun Mi;KWON, Soon Gyu;KIM, Sang Hwa;LEE, Sang Young;LEE, Jin Hak;LEE, Han Su;JEONG, Dong Hun;JEONG, In Ho;CHOI, Dae Young;HWANG, Jung Ho
