发明名称 エポキシ樹脂組成物及び電子部品装置
摘要 An epoxy resin composition includes: (A) an epoxy resin containing a compound represented by the following Formula (I); (B) a phenol resin containing a compound represented by the following Formula (II); and (C) a dihydroxynaphthalene compound containing a compound represented by the following Formula (III). In Formula (I), R represents a hydrogen atom, and n represents an integer from 0 to 10. In Formula (II), R 1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms, and each R 1 may be the same as or different from another R 1 . n represents an integer from 0 to 10. In Formula (III), R 1 represents a hydrogen atom, an alkyl group having from 1 to 6 carbon atoms, or an alkoxy group having 1 or 2 carbon atoms.
申请公布号 JP6060904(B2) 申请公布日期 2017.01.18
申请号 JP20130536404 申请日期 2012.09.27
申请人 日立化成株式会社 发明人 荻原 弘邦;古沢 文夫;中村 真也;池内 孝敏;山本 高士
分类号 C08G59/32;C08G59/62;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/32
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