| 摘要 |
Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a support substrate, a first light emitting structure provided on the support substrate and comprising a first conductive type first semiconductor layer, a first active layer under the first conductive type first semiconductor layer, and a second conductive type second semiconductor layer under the first active layer, a first metal layer under the first light emitting structure, a second light emitting structure provided on the support substrate and comprising a first conductive type third semiconductor layer, a second active layer under the first conductive type third semiconductor layer, and a second conductive type fourth semiconductor layer under the second active layer, a second metal layer under the second light emitting structure, and a contact part making contact with a lateral side of the first conductive type first semiconductor layer and electrically connected to the second metal layer. |
