| 摘要 |
In a case in which mounting deviation is occurring in a component C which is mounted onto a solder surface of a board 18, a pad jig 51 is pushed against the component C (refer to Figs. 9 (a) and (b) ), and the mounting deviation of the component C is corrected through a friction force between the pad jig 51 and the component C (refer to Fig. 9 (d) ) by causing the pad jig 51 to move in a horizontal direction (refer to Fig. 9 (c) ). Accordingly, it is possible to automatically correct the mounting deviation of the component C using a simple configuration. As a result, it is possible to automate the correction work which is performed by the manual work of the worker in the related art, and it is possible to greatly reduce the labor of the worker. |
