| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer protective member which allows for excellent thinning even of a wafer having a planar device surface where bump is not formed, without causing any damage or contamination of a device on the surface side of a wafer.SOLUTION: A wafer protective member 1 protects the surface WS of a wafer W in which a device is formed. The wafer protective member 1 is constituted of an outer periphery sticking part 3 being stuck to the outer peripheral region GR of the wafer W where a device is not formed, a device protective part 4 abutting against the device while being surrounded by the outer periphery sticking part 3 and protecting the device under non-sticking state, and the like. The plane 6 where the surface 7 of the outer periphery sticking part 3 abuts against the surface WS of a wafer W is formed of the same plane. |
