INSULATING STRUCTURE FOR POWER MODULE AND POWER CONVERSION DEVICE USING POWER MODULE

摘要

Provided is a power conversion device including an insulating member manufactured such that a thickness di (mm) of the insulating member made from a resin, provided between a heat dissipating surface of a conductor plate bonded to a power semiconductor device and a heat dissipating plate that dissipates the heat of the power semiconductor device satisfies a relation of di > (1.36 × 10-8 × Vt2 + 3.4 × 10-5 × Vt - 0.015) × µr, where a relative permittivity of the insulating member is µr and a surge voltage generated between the conductor plate and the heat dissipating plate accompanied by an ON/OFF switching operation of the power semiconductor device is Vt (V). The conductor plate of the power semiconductor device, the insulating member, and the heat dissipating plate are bonded by thermocompression bonding.