| 摘要 |
PROBLEM TO BE SOLVED: To provide an assembly jig of a semiconductor device having an outsert terminal structure, and a method of manufacturing a semiconductor device by using the assembly jig.SOLUTION: An assembly jig 100 is constituted of an outer frame 1 disposed on an insulation substrate 52 with a conductive pattern, and a bracing 2 for supporting an independent terminal 53, i.e., an external lead-out terminal disposed on the outer frame 1. When soldering the independent terminal 53 to the insulation substrate 52 with a conductive pattern by using the assembly jig 100, the bottom of the independent terminal 53 disposed across the bracing 2 is brought into contact with a plate solder 54 before fusion on the insulation substrate 52 with a conductive pattern. The assembly jig 100 and the independent terminal 53 are brought into contact by the total deadweight thereof. Since soldering is performed in a state where the assembly jig 100 and the independent terminal 53 are brought into contact by the deadweight, pressure is not applied excessively to a molten solder 55. Consequently, the shape of a solder fillet can be optimized. As a result, a highly reliable semiconductor device can be obtained. |
