发明名称 Method of forming a microstructure
摘要 The present invention relates to a method of forming a microstructure comprising, providing a transparent substrate having a structured surface region comprising one or more recessed features with recessed surfaces, the structured surface region substantially free of plateaus; disposing a fluid conductive ink composition comprising a functional material and a liquid onto the structured surface region; evaporating liquid from the fluid composition, the functional material collecting on the recessed surfaces such that the remainder of the structured surface region is substantially free of the functional material, wherein the functional material comprises conductive polymer, metal, or a combination thereof; and backfilling the recessed features with a transparent refractive index matching material.
申请公布号 EP2620523(A3) 申请公布日期 2017.01.18
申请号 EP20130163970 申请日期 2009.06.25
申请人 3M Innovative Properties Company 发明人 Stay, Matthew, S.;Pekurovsky, Mikail L.;Mora, Cristin, E.;Frey, Matthew, S.
分类号 C23C18/16;C09D11/00;C09D11/52;C23C18/06;C23C18/08;C23C18/30;G02F1/155;G03F7/00;H05K1/02;H05K3/10;H05K3/12;H05K3/18;H05K3/24;H05K9/00 主分类号 C23C18/16
代理机构 代理人
主权项
地址