| 摘要 |
Provided is a substrate processing device capable of improving throughput without increasing the operation speed of a drive device. Vacuum processing chambers which house a wafer for plasma processing of the wafer are respectively provided with gate valves for opening and closing a wafer inlet/outlet port, and wafer detection sensors for detecting the wafer moving forward or backward through the wafer inlet/outlet port, and a scara robot for making extending/retracting motion and rotating motion transfers the wafer. At this time, the scara robot starts the rotating motion to transfer the wafer picked up from the vacuum processing chamber in response to a trigger signal transmitted from the wafer detection sensor. The trigger signal indicates that the wafer has passed through the wafer inlet/outlet port and has arrived at a point where the gate valve and the wafer inlet/outlet port no longer interfere with the wafer. |
