Microelectronic assembly with multi-layer support structure

摘要

A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

主权项

1. A method of forming a microelectronic assembly, comprising:
positioning a support structure adjacent to an active region of a device but not extending onto the active region, thereby positioning the support structure on a surface of the device, the support structure having a first adhesive layer for bonding with the surface of the device, and having a second adhesive layer facing away from the surface of the device, and a first structural layer between the first and second adhesive layers, positioning a second structural layer which projects from a major surface of a lid so that the second structural layer contacts the second adhesive layer and the lid extends over the active region of the device; and exposing the first and second adhesive layers to environmental conditions to cause the first and second adhesive layers to bond to the device and to the second structural layer, respectively, wherein the support structure and the second structural layer resist deformation under the environmental conditions associated with bonding the first and second adhesive layers to the device and the second structural layer, respectively.