Package structure and method for manufacturing same

摘要

The present disclosure relates to a method for manufacturing a LED package structure. First, a support plate including a top surface is provided. An annular groove is defined on the top surface and a protruding portion on the support plate is surrounded by the annular groove. Second, a reflecting layer is formed on surfaces and periphery portions of the annular groove. Then, a wiring pattern is formed on the top surface corresponding to the protruding portion. An insulting layer is formed in spaces of the wiring pattern and the annular groove. The support plate is removed and a receiving groove is formed by the insulting layer and the corresponding protruding portion. Finally, a LED chip is received in the receiving groove and bonded on the wiring pattern to obtain a LED package structure. A LED package structure made by the above method is also provided.

主权项

1. A method of manufacturing a LED packaging structure comprising:
providing a support plate to be used as a substrate, the support plate includes a top surface and a bottom surface opposite to the top surface, the support plate further includes an annular recess formed on the top surface, a portion of the support plate surrounded by the annular recess is formed as a protruding portion; forming a reflective layer on the surface of the annular recess and the edge of the protruding portion near the annular recess; forming a wiring pattern on the top surface of the protruding portion; forming an insulating layer to fill in the gaps of the wiring pattern and to fill in the annual recess; forming a receiving groove on the position of the insulating layer corresponding to the position of the protruding portion after removing the support plate; and accommodating a LED chip in the receiving groove, the LED chip with conductive pins are bonded on the wiring pattern by solder balls.