| 发明名称 |
Printed circuit board assembly for use in space missions |
| 摘要 |
An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB. |
| 申请公布号 |
US9549467(B1) |
申请公布日期 |
2017.01.17 |
| 申请号 |
US201314041407 |
申请日期 |
2013.09.30 |
| 申请人 |
The United States of America as represented by the Administrator of the National Aeronautics and Space Administration |
发明人 |
Petrick David J.;Vo Luan;Albaijes Dennis |
| 分类号 |
H05K7/10;H05K7/12;H05K1/11 |
主分类号 |
H05K7/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic assembly for use in space missions, the electronic assembly comprising: a PCB; one or more multi-pin column grid array (CGA) devices coupled to the printed circuit board (PCB); and one or more multi-bin-pad features it, the PCB; wherein each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via, and wherein the PCB comprises a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB; wherein the assembly comprises a pair of CGA device coupled to the PCB in a back-to-back arrangement, and wherein each pin of the first CGA device is located directly opposite a similarly located pin of the second CGA device. |
| 地址 |
Washington DC US |
