| 发明名称 | Reticle for non-rectangular die | ||
| 摘要 | The present disclosure provides a semiconductor structure. The semiconductor structure includes a non-rectangular die area, a dicing ring and a reticle area surrounding the non-rectangular die. The dicing ring is within the reticle area and surrounds the non-rectangular die area. The number of edges of the reticle area is not equal to 4. | ||
| 申请公布号 | US9548274(B1) | 申请公布日期 | 2017.01.17 |
| 申请号 | US201514947787 | 申请日期 | 2015.11.20 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. | 发明人 | Yu Chen-Hua;Chen Ming-Fa;Yeh Sung-Feng |
| 分类号 | H01L23/544;H01L25/00;H01L21/78;H01L23/538;H01L21/268;H01L21/3065;H01L27/088;H01L27/092 | 主分类号 | H01L23/544 |
| 代理机构 | WPAT, P.C., Intellectual Property Attorneys | 代理人 | WPAT, P.C., Intellectual Property Attorneys ;King Anthony |
| 主权项 | 1. A semiconductor structure, comprising: a non-rectangular die area; a reticle area surrounding the non-rectangular die area; and a dicing ring within the reticle area and surrounding the non-rectangular die area, wherein the number of edges of the reticle area is not equal to 4. | ||
| 地址 | Hsinchu TW | ||