| 发明名称 | Microphone package | ||
| 摘要 | According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization. | ||
| 申请公布号 | US9549261(B2) | 申请公布日期 | 2017.01.17 |
| 申请号 | US201314045153 | 申请日期 | 2013.10.03 |
| 申请人 | Kabushiki Kaisha Toshiba | 发明人 | Higashi Yoshihiro;Fuji Yoshihiko;Hara Michiko;Yuzawa Akiko;Kaji Shiori;Nagata Tomohiko;Hori Akio;Fukuzawa Hideaki |
| 分类号 | H04R25/00;H04R7/10;H04R19/04 | 主分类号 | H04R25/00 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A sensor comprising: a film being deformable; and a sensing element provided on the film and comprising: a first magnetic layer having a first magnetization along a first direction,a second magnetic layer having a second magnetization; andan intermediate layer provided between the first magnetic layer and the second magnetic layer; and a housing, the film and the sensing element being provided in the housing, the housing comprising: a first portion being magnetic, at least a part of the first portion being arranged with the first magnetization in the first direction. | ||
| 地址 | Minato-ku JP | ||