发明名称 Member for semiconductor manufacturing apparatus and method for manufacturing the same
摘要 A high-frequency power supply includes a shaft bonded to one surface of a plate serving as a gas distributor plate. The plate includes a radio-frequency electrode buried therein. The shaft has a through-hole through which a gas flows. The plate and the shaft are made of a ceramic material. The shaft has a double-tube structure including the inner tube and the outer tube . The interior space of the inner tube forms the through-hole. The plate is hermetically solid-state bonded to the inner tube and the outer tube. The shaft is bonded to the center of the plate.
申请公布号 US9548226(B2) 申请公布日期 2017.01.17
申请号 US201314058604 申请日期 2013.10.21
申请人 NGK Insulators, Ltd. 发明人 Unno Yutaka;Abe Tetsuhisa
分类号 H01L21/67;B23K20/12;H01L21/683;H01L21/687 主分类号 H01L21/67
代理机构 Burr & Brown, PLLC 代理人 Burr & Brown, PLLC
主权项 1. A high-frequency power supply for a semiconductor manufacturing apparatus, comprising: a gas distributor plate including an RF electrode buried therein; and a shaft bonded to one surface of the gas distributor plate, the shaft having a through-hole through which a gas flows, the gas from the through-hole being discharged from a plurality of holes disposed in the gas distributor plate, wherein the gas distributor plate and the shaft are made of a ceramic material, the shaft has a double-tube structure including an inner tube and an outer tube, a first interior space within the inner tube to form the through-hole through which the gas flows, and a second interior space between a radially outer surface of the inner tube and a radially inner surface of the outer tube, and the plurality of holes extend from the one surface of the gas distributor plate to a second surface of the gas distributor plate that is opposite to the one surface of the gas distributor plate.
地址 Nagoya JP