| 发明名称 | Method for forming film layer and substrate including the film layer | ||
| 摘要 | A method of forming a film layer and a substrate comprising the film layer to reduce occurrence of defects and improve the quality of the film layer are described. The method of forming a film layer comprises forming a plurality of sub-film layers of a same material overlapped with each other on a substrate by multiple steps to constitute the film layer, wherein each time a sub-film layer is formed, the newly-formed sub-film layer is cleaned immediately. The substrate comprises a film layer formed by the above method. | ||
| 申请公布号 | US9546421(B2) | 申请公布日期 | 2017.01.17 |
| 申请号 | US201314363784 | 申请日期 | 2013.12.16 |
| 申请人 | BOE Technology Group Co., Ltd.;Beijing BOE Display Technology Co., Ltd. | 发明人 | Tang Hua;Zhao Ran |
| 分类号 | C23C16/44;C23C16/40;C23C14/08;C23C14/22;C23C4/00;G02F1/1343;C23C4/06;C23C4/12;C23C4/18;C23C4/10;C23C14/00;C23C16/00;C23C14/34;C23C14/58;C23C16/56;C23C14/02;B08B11/00;B05D7/00;B05D5/00;B05D1/02;B05D1/08;B05D3/10;B05D1/10;G02F1/13 | 主分类号 | C23C16/44 |
| 代理机构 | Blakely, Sokoloff, Taylor & Zafman LLP | 代理人 | Blakely, Sokoloff, Taylor & Zafman LLP |
| 主权项 | 1. A method of forming a film layer, comprising: forming a plurality of sub-film layers of a same material overlapped with each other on a substrate by multiple operations to constitute the film layer, wherein the material is a metal or a metal oxide, wherein each time a sub-film layer is formed, the newly-formed sub-film layer is cleaned immediately and wherein power of equipment for forming the sub-film layers is controlled in a range of 6.8 kW to 7.8 kW, wherein each of knobbles formed on the sub-film layers is less than 50 microns in size. | ||
| 地址 | Beijing CN | ||