| 主权项 |
1. A driver integrated circuit device, the device comprising:
a front-end module; a pre-driver module coupled to the front-end module, the pre-driver module including one or more delay adjust capacitor modules, one or more pull-up control modules, and one or more pull-down control modules; wherein each of the delay adjust capacitor modules includes a skew mos module, a skew resistor module, and a cap array module; wherein the skew mos module includes a first transistor pair, a second transistor pair, and a third transistor pair configured to a mos input node, a mos output node, a cap node, a pull-up connection node, and a pull-down connection node; wherein the skew resistor module includes a plurality of resistors coupled in a series connection and having a plurality of resistor connection nodes at each junction between the resistors and the ends of the series connection; wherein the plurality of resistor connection nodes includes a cap node, a pull-up connection node, and a pull-down connection node; a driver module coupled to the pre-driver module, the driver module including one or more pull-up control logic modules and one or more pull-down control logic modules; and a transmission line path coupled to the driver module. |
