Semiconductor device package for debugging and related fabrication methods

摘要

Electronic device packages and related fabrication methods are provided. An exemplary electronic device includes a semiconductor die having debug circuitry fabricated thereon, a framing structure including an interior portion having the semiconductor die mounted thereto, and a conductive element providing an electrical connection between the interior portion and a contact pad on the semiconductor die that corresponds or is otherwise coupled to an interface of the debug circuitry.

主权项

1. An electronic device comprising:
a semiconductor die having debug circuitry fabricated thereon, the semiconductor die comprising a contact pad coupled to the debug circuitry; a framing structure including a package interface portion and an interior portion, the interior portion having an edge inwardly offset from the package interface portion and the interior portion having the semiconductor die mounted thereto, wherein an edge of the semiconductor die is inwardly offset from the edge of the interior portion; and a conductive element providing an electrical connection between the contact pad and an accessible portion of the interior portion between the edge of the semiconductor die and the edge of the interior portion.