| 发明名称 | Multilayer printed circuit board | ||
| 摘要 | A multilayer PCB comprises vias for power-supply connected to power-supply wiring, vias for ground connected to ground wiring, ball pads for power-supply connected to balls for power-supply connected to power-supply wiring, and ball pads for ground connected to balls for ground connected to ground wiring. The vias for power-supply and the vias for ground are alternately arranged in a first direction. The vias for power-supply and the vias for ground are not alternately arranged in a second direction perpendicular to the first direction. The ball pads for power-supply and the ball pads for ground are alternately arranged in at least one of the first and second directions. Areas where the ball pads for power-supply and the ball pads for ground are provided are arranged on both sides in the second direction of an area where the vias for power-supply and the vias for ground are provided. | ||
| 申请公布号 | US9549459(B2) | 申请公布日期 | 2017.01.17 |
| 申请号 | US201214374198 | 申请日期 | 2012.01.27 |
| 申请人 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. | 发明人 | Ito Yoshinobu;Oosumi Hideo |
| 分类号 | H05K7/10;H05K7/12;H05K1/02;H01L23/498;H01L23/50;H05K1/18;H05K1/11 | 主分类号 | H05K7/10 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A multilayer printed circuit board (PCB) for mounting an integrated circuit, the multilayer PCB comprising: a plurality of vias for power supply electrically connected to power supply wiring; a plurality of vias for ground electrically connected to ground wiring; a plurality of ball pads for power supply connected to balls for power supply electrically connected to the power supply wiring; and a plurality of ball pads for ground connected to balls for ground electrically connected to the ground wiring, wherein while the vias for power supply and the vias for ground are alternately arranged in a first direction, the vias for power supply and the vias for ground are not alternately arranged in a second direction perpendicular to the first direction, the ball pads for power supply and the ball pads for ground are alternately arranged in at least one of the first direction and the second direction, areas where the ball pads for power supply and the ball pads for ground are provided are arranged on both sides in the second direction of an area where the vias for power supply and the vias for ground are provided, and in the second direction, adjacent vias for power supply or adjacent vias for ground are arranged apart from each other so that at least two lines of the ball pads for power supply or the ball pads for ground are disposed between the adjacent vias for power supply or the adjacent vias for ground. | ||
| 地址 | Osaka JP | ||