Pressure sensor and packaging method thereof

摘要

According to an embodiment of the present invention, a pressure sensor includes: a pressure sensing chip, which includes a substrate, a sensing film, an insulation layer and a first bonding pad; wherein the sensing film is on the substrate, and a sagging step is formed at one side of the substrate; the insulation layer is prepared on the sensing film and the substrate; the first bonding pad is prepared on the insulation layer on a bottom surface of the step, and is connected to the region of the substrate close to the sensing film via a lead wire.

主权项

1. A pressure sensor, comprising:
a pressure sensing chip, which comprises a substrate, a sensing film, an insulation layer and a first bonding pad; wherein the sensing film is on the substrate, and a sagging step is formed at one side of the substrate; the insulation layer is prepared on the sensing film and the substrate; the first bonding pad is prepared on the insulation layer on a bottom surface of the step, and is connected to the region of the substrate close to the sensing film via a lead wire; an IC chip having a third bonding pad; wherein the pressure sensing chip is attached on the IC chip with the third bonding pad exposed; the first bonding pad is connected to the third bonding pad via a second metal wire; and, a base plate having a second bonding pad; wherein the IC ship is attached on the base plate with the second bonding pad exposed; the second bonding pad is connected to the third bonding pad via a first metal wire.