发明名称 |
Methods of fabricating an F-RAM |
摘要 |
Non-volatile memory cells including complimentary metal-oxide-semiconductor transistors and embedded ferroelectric capacitor and methods of forming the same are described. In one embodiment, the method includes forming on a surface of a substrate a gate level including a gate stack of a MOS transistor, a first dielectric layer overlying the MOS transistor and a first contact extending through the first dielectric layer from a top surface thereof to a diffusion region of the MOS transistor. A local interconnect (LI) layer is deposited over the top surface of the first dielectric layer and the first contact, a ferro stack including a bottom electrode, a top electrode and ferroelectric layer there between deposited over the LI layer, and the ferro stack and the LI layer patterned to form a ferroelectric capacitor and a LI through which the bottom electrode is electrically coupled to the diffusion region of the MOS transistor. |
申请公布号 |
US9548348(B2) |
申请公布日期 |
2017.01.17 |
申请号 |
US201314109045 |
申请日期 |
2013.12.17 |
申请人 |
Cypress Semiconductor Corporation |
发明人 |
Sun Shan;Ramkumar Krishnaswamy;Davenport Thomas;Patel Kedar |
分类号 |
H01L21/00;H01L49/02;H01L27/115;H01L21/768 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method comprising:
forming a gate level on a surface of a substrate, the gate level including a gate stack of a metal-oxide-semiconductor (MOS) transistor, a first dielectric layer overlying the MOS transistor and a first contact extending through the first dielectric layer from a top surface thereof to a diffusion region of the MOS transistor in the substrate; depositing a local interconnect (LI) layer over the top surface of the first dielectric layer and the first contact, the LI layer comprising aluminum titanium nitride (AlTiN); depositing an iridium layer on the LI layer; depositing directly on the iridium layer a ferroelectric layer and a top electrode layer; patterning the top electrode layer, the ferroelectric layer and the iridium layer, stopping on the LI layer to form a ferro stack; patterning the LI layer to concurrently form a ferroelectric capacitor comprising the ferro stack and a bottom electrode comprising the patterned iridium layer and a portion of the LI layer through which the bottom electrode is electrically coupled to the diffusion region of the MOS transistor, and a LI comprising an exposed portion of the LI layer not covered by the ferro stack; and concurrently encapsulating the ferroelectric capacitor and the LI with an encapsulation layer, wherein encapsulating the LI comprises depositing the encapsulation layer directly on a top surface and sidewalls of LI. |
地址 |
San Jose CA US |