发明名称 Method for producing semiconductor light receiving device and semiconductor light receiving device
摘要 A method for producing a semiconductor light receiving device includes the steps of growing a stacked semiconductor layer on a principal surface of a substrate, the stacked semiconductor layer including a light-receiving layer having a super-lattice structure, the super-lattice structure including a first semiconductor layer and a second semiconductor layer that are stacked alternately; forming a mask on the stacked semiconductor layer; forming a mesa structure on the substrate by etching the stacked semiconductor layer using the mask so as to form a substrate product, the mesa structure having a side surface exposed in an atmosphere; forming a fluorinated amorphous layer on the side surface of the mesa structure by exposing the substrate product in fluorine plasma; and after the step of forming the fluorinated amorphous layer, forming a passivation film containing an oxide on the side surface of the mesa structure.
申请公布号 US9548330(B2) 申请公布日期 2017.01.17
申请号 US201514962793 申请日期 2015.12.08
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 Tsuji Yukihiro
分类号 H01L27/146 主分类号 H01L27/146
代理机构 Smith, Gambrell & Russell, LLP. 代理人 Smith, Gambrell & Russell, LLP.
主权项 1. A method for producing a semiconductor light receiving device, the method comprising the steps of: growing a stacked semiconductor layer on a principal surface of a substrate, the stacked semiconductor layer including a light-receiving layer having a super-lattice structure, the super-lattice structure including a first semiconductor layer and a second semiconductor layer that are stacked alternately; forming a mask on the stacked semiconductor layer; forming a mesa structure on the substrate by etching the stacked semiconductor layer using the mask so as to form a substrate product, the mesa structure having a side surface exposed in an atmosphere; forming a fluorinated amorphous layer on the side surface of the mesa structure by exposing the substrate product in fluorine plasma; and after the step of forming the fluorinated amorphous layer, forming a passivation film containing an oxide on the side surface of the mesa structure.
地址 Osaka JP