Package redistribution layer structure and method of forming same

摘要

A package-on-package (PoP) device comprises a bottom package on a substrate and a first set of conductive elements coupling the bottom package and the substrate. The PoP device further comprises a top package over the bottom package and a redistribution layer coupling the top package to the substrate. A method of forming a PoP device comprises coupling a first package to a substrate; and forming a redistribution layer over the first package and a top surface of the substrate. The method further comprises coupling a second package to the redistribution layer, wherein the redistribution layer couples the second package to the substrate.

主权项

1. A package-on-package (PoP) device comprising:
a bottom package on a substrate; a first conductive contact on the substrate; a first set of conductive elements coupling the bottom package and the substrate; a top package over the bottom package; a first redistribution layer on a top surface and a sidewall of the bottom package, wherein the first redistribution layer couples the top package to the substrate, and wherein the first redistribution layer comprises:
a first portion of the first redistribution layer being on the top surface of the bottom package, the first portion of the first redistribution layer having a top surface, a bottom surface opposite the top surface, and sidewalls extending from the top surface to the bottom surface of the first portion, the bottom surface of the first portion being in physical contact with the top surface of the bottom package;a second portion of the first redistribution layer being along the sidewall of the bottom package, the second portion of the first redistribution layer having a sidewall in physical contact with a majority of the sidewall of the bottom package, the sidewall of the second portion of the first redistribution layer being substantially perpendicular to the bottom surface of the first portion of the first redistribution layer; anda third portion of the first redistribution layer being on the first conductive contact on the substrate, the second portion of the first redistribution layer extending from the first to the third portions of the first redistribution layer, the third portion of the first redistribution layer having a top surface, a bottom surface opposite the top surface, and sidewalls extending from the top surface to the bottom surface of the third portion, the bottom surface of the third portion being in physical contact with a top surface of the first conductive contact; a second redistribution layer on the top surface and a sidewall of the bottom package, wherein the second redistribution layer couples the top package to the substrate, and wherein the second redistribution layer comprises a first portion on the top surface of the bottom package, the first portion of the second redistribution layer having a top surface, a bottom surface opposite the top surface, and sidewalls extending from the top surface to the bottom surface of the first portion of the second redistribution layer; an underfill material between the bottom package and the substrate, the second portion of the first redistribution layer having a sidewall in physical contact with a sidewall of the underfill material; and a molding compound on a top surface of the substrate, between the bottom package and the top package and along sidewalls of the top package, the molding compound being in physical contact with the top surfaces and sidewalls of both the first portion and the third portion of the first redistribution layer, the molding compound further being in physical contact with the top surface and sidewalls of first portion of the second redistribution layer, the molding compound completely separating the first portion of the the first redistribution layer from the first portion of the second redistribution layer.