Support frame with integrated thermal management features

摘要

This invention describes a novel solution to providing heat redistribution and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. Liquid (e.g., coolants) contained in the portion of the heat management features most proximate to the processing components evaporates due to the absorbed heat, and is conducted (via convection) towards the other end of the heat management features, where the temperature is cooler. Once sufficiently cooled, the evaporated coolant condenses back into liquid form and flows back towards the other end of the heat management features.

主权项

1. A mobile computing device, comprising:
a front panel comprising a display panel; a back panel; a mid-frame comprising a plurality of integrated thermal management structures encased by the mid-frame, the mid-frame being configured to provide mechanical support for the mobile computing device and disposed between the front panel and the back panel; and a printed circuit board (PCB) disposed between at least a portion of the front panel and at least a portion of the mid-frame, the PCB comprising a plurality of components including at least one processor, wherein the plurality of integrated thermal management structures comprise: a plurality of vapor chambers each surrounded by a respective chamber configured to contain at least one of a sintering powder or a wick structure having a plurality of grooves such that the at least one of the sintering powder or the wick structure contact a respective exterior portion of each of the vapor chambers; a first region of the mid-frame configured to be proximate to a heat source; and a second region of the mid-frame, wherein the mid-frame is configured to contain a liquid coolant, wherein the mid-frame is configured for a portion of the liquid coolant evaporated by heat absorbed from the heat source to be condensed in the second region of the mid-frame, wherein the mid-frame is further configured for a condensed portion of the liquid coolant to flow from the second region of the mid-frame to the first region of the mid-frame.