发明名称 Microtruss based thermal heat spreading structures
摘要 A heat transport structure is provided having a structural microtruss wick with a thermal transport medium associated with the microtruss wick for thermal energy transport by fluid and vapor transport between a heat source and a heat sink.
申请公布号 US9546826(B1) 申请公布日期 2017.01.17
申请号 US201012691393 申请日期 2010.01.21
申请人 HRL Laboratories, LLC 发明人 Carter William B.;Gross Adam F.;Guinn Keith V.;Jacobsen Alan J.;Kisailus David
分类号 F28D15/00;F28D15/04;F28D15/02 主分类号 F28D15/00
代理机构 代理人 Balzan Christopher R.
主权项 1. A heat spreading structure comprising: a) a microtruss wick comprising an ordered three dimensional network of continuous interpenetrating microtruss members, the microtruss members constructed to transport fluid through capillary forces; b) wherein the plurality of microtruss members comprises at least two length scales of microtruss members comprising: (1) a first plurality of microtruss members;(2) a second plurality of microtruss members; and(3) wherein the second plurality of microtruss members are larger than the first plurality of microtruss members such that the first plurality of microtruss members are more closely spaced together than the second plurality of microtruss members; c) a thermal transport medium associated with the microtruss wick for thermal energy transport by fluid and vapor transport between a heat source and a heat sink; d) wherein the plurality of first microtruss members form first nodes, and wherein each of the plurality of first microtruss members forming the first nodes extends beyond the first nodes along a same direction so as to form other nodes with others of the plurality of first microtruss members, and wherein the second plurality of microtruss members form second nodes and change direction at each of the second nodes; and e) wherein the first plurality of microtruss members overlap a part of the second plurality of microtruss members.
地址 Malibu CA US
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