Post-CMP hybrid wafer cleaning technique

摘要

A brush-cleaning apparatus is disclosed for use in cleaning a semiconductor wafer after polishing. Embodiments of the brush-cleaning apparatus implemented with a multi-branch chemical dispensing unit are applied beneficially to clean semiconductor wafers, post-polish, using a hybrid cleaning method. An exemplary hybrid cleaning method employs a two-chemical sequence in which first and second chemical treatment modules are separate from one another, and are followed by a pH-neutralizing-rinse that occurs in a treatment module separate from the first and second chemical treatment modules. Implementation of such hybrid methods is facilitated by the multi-branch chemical dispensing unit, which provides separate chemical lines to different chemical treatment modules, and dispenses chemical to at least four different areas of each wafer during single-wafer processing in an upright orientation. The multi-branch chemical dispensing unit provides a flexible, modular building block for constructing various equipment configurations that use multiple chemical treatments and/or pH neutralization steps.

主权项

1. A brush-cleaning apparatus for use in cleaning semiconductor wafers, the brush-cleaning apparatus comprising:
two chemical treatment stages separate from one another, each chemical treatment stage including:
an alignment mechanism configured to position a semiconductor wafer in a vertical orientation within the chemical treatment stage,a pair of rotatable brushes disposed on opposite sides of the semiconductor wafer at a selected distance measurable and adjustable by the alignment mechanism, anda multi-branch chemical dispensing unit whose distance from the semiconductor wafer is adjustable and that is configured to deliver chemical separately to the two or more chemical treatment stages, and to apply the chemical to at least four different areas of the semiconductor wafer at a measured and adjustable distance from the wafer; a pH neutralization stage, separate from the chemical treatment stages; and a wafer drying stage.