SURFACE-TREATED COPPER FOIL, COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, METHOD FOR FABRICATING SURFACE-TREATED COPER FOIL, AND METHOD FOR FABRICATING PRINTED WIRING BOARD

摘要

Provided is a surface-treated copper foil which has a good peel strength and well suppreses transmission loss even when being used for a high-frequency circuit substrate. The surface-treated copper foil according to the present invention is a surface-treated copper foil having, in order, a copper foil, a metal layer containing one or more elements selected from a group consisting of Ni, Co, Zn, W, Mo, and Cr, and a surface-treated layer formed from a chromium oxide, wherein a total amount of the elements selected from the group consisting of Ni, Co, Zn, W, Mo, and Cr deposited in the metal layer is 200-2000 mg/dm2, and when the surface-treated copper foil is heat-treated at 250oC x 10 minutes and thereafter soaked in a nitric acid bath at a concentration of 20 pcnt by mass at a temperature of 25oC for 30 seconds with only a surface of the surface-treated layer exposed, an amount of copper eluted in the nitric acid bath is 0.0030 g/25cm2 or less.