发明名称 |
SUBSTRATE PROCESSING APPARATUS |
摘要 |
Provided is a substrate processing apparatus capable of improving thickness uniformity. The substrate processing apparatus includes a process chamber including a shower head, a feeding block including a tube to provide a source gas and a reaction gas to the shower head, and a mixing block configured to provide a channel connected between the shower head and the feeding block to mix the source gas and the reaction gas, and the mixing block includes an internal space having a cross-sectional area larger than the cross-sectional area of the tube provided in the feeding block, and a collision part provided on a path of a gas mixture of the source gas and the reaction gas to collide with the gas mixture. |
申请公布号 |
US2017008015(A1) |
申请公布日期 |
2017.01.12 |
申请号 |
US201615196293 |
申请日期 |
2016.06.29 |
申请人 |
WONIK IPS CO., LTD. |
发明人 |
LA Doo Hyun;RYU Dong Ho;PARK Ju Sung;PARK Ju Sung;LEE Sang Woo |
分类号 |
B05B1/18;B05B1/00;C23C16/455 |
主分类号 |
B05B1/18 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate processing apparatus comprising:
a process chamber comprising a shower head; a feeding block comprising a tube to provide a source gas and a reaction gas to the shower head; and a mixing block configured to provide a channel connected between the shower head and the feeding block to mix the source gas and the reaction gas, wherein the mixing block comprises: an internal space having a cross-sectional area larger than the cross-sectional area of the tube provided in the feeding block; and a collision part provided on a path of a gas mixture of the source gas and the reaction gas to collide with the gas mixture. |
地址 |
Gyeonggi-do KR |