发明名称 |
DEPOSITING BULK OR MICRO-SCALE ELECTRODES |
摘要 |
Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer. |
申请公布号 |
US2017013713(A1) |
申请公布日期 |
2017.01.12 |
申请号 |
US201615274363 |
申请日期 |
2016.09.23 |
申请人 |
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC |
发明人 |
Shah Kedar G.;Pannu Satinderpall S.;Tolosa Vanessa;Tooker Angela C.;Sheth Heeral J.;Felix Sarah H.;Delima Terri L. |
分类号 |
H05K1/11;H05K3/40;A61N1/05;H05K3/20;H05K3/12;H05K1/09;H05K3/28 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
|
主权项 |
1. A method of fabricating or depositing electrode materials, comprising the steps of:
depositing an electrically insulating polymer layer on a substrate, depositing a thin-film electrical conducting layer to form electrical conduits connecting, bulk depositing an electrode layer on said thin-film electrical conducting layer, depositing an encapsulating electrically insulating polymer layer on said thin-film electrical conducting layer and said electrode layer, removing some of said insulating layer covering said electrode layer, and releasing the electrode materials from said substrate. |
地址 |
Livermore CA US |