| 主权项 |
1. A method of peeling a laminate, the method comprising:
forming a first adhesive layer on a first substrate, the first adhesive layer having adhesive force that satisfies the following Expression (1) and one or both of the following Expressions (2) and (3); firmly attaching a second substrate onto the first adhesive layer; forming a first functional layer on the second substrate; and peeling off the first substrate from the second substrate,A<x2L2+4x2·(σmax-6E·hL2·x)(1) where “L” is a length of the first substrate in a direction in which the first substrate is peeled off, “h” is a thickness of the first substrate in millimeter, “x” is an allowable deformation amount of the first substrate, “E” is a Young's modulus of the first substrate, and “σmax” is a limit bending stress of the first substrate,
B′<C−ρhg (2) where “B” is adhesive force between the first substrate and the second substrate at a peeling start part when the peeing is performed, “C” is peeling force in a vertical direction (in a Z-axis direction) when the peeling is performed, “ρ” is a density of the first substrate, “h” is the thickness of the first substrate in millimeter, and “g” is gravitational constant,1=rr-d·d(2r-d)(3) where “l” is a width of a region in which the peeling is started, “d” is an amount of projection and warpage of the first substrate, and “r” is a curvature radius. |
