| 摘要 |
A wafer de-bonding device comprises a table top (1) for placing a bonded wafer and a carrying slide, and a cutter (2) provided with an air outlet (2.2). The cutter (2) is disposed nearby the table top (1) by mans of an adjustable device. By means of the adjustable device, the cutter (2) is controlled to perform movements of moving away from or towards the table top (1). The cutter (2) is provided with a bit (2.1) used for performing puncture to form a notch in a film or glue at the bonding position between the bonded wafer and the carrying slide. The air outlet (2.2) is disposed in the bit (2.1). The cutter (2) is also provided with an air inlet (2.3). The air inlet (2.3) is communicated with the air outlet (2.2). The air inlet (2.3) is connected to a gas generation device, so as to blow air towards the bonding position between the bonded wafer and the carrying slide on the table top (2). By using the wafer de-bonding device, the automation degree is high and operations are simpler. |
