| 摘要 |
The invention relates to a system (1) for checking soldering points, comprising a device (3) for automatically checking solder paste, said device determining a solder paste quantity applied onto a soldering surface, and comprising a device (5) for automatically inspecting soldering points, said device detecting at least one quality feature of a soldering point to be checked in a specified inspection region of the soldering surface and comparing said quality feature with a specified threshold. The device (5) for automatically inspecting soldering points evaluates the soldering point to be checked as a good-quality soldering point (ASJIRG) or as a defective soldering point (ASJIRB) on the basis of the comparison result. The invention also relates to a method for inspecting soldering points. According to the invention, an analysis and control unit (10) ascertains the threshold for the at least one quality feature on the basis of the solder paste quantity determined for the soldering point to be checked and provides the threshold to the device (5) for automatically inspecting soldering points in order to check the corresponding soldering point. |
