| 发明名称 |
SPINAL IMPLANT SYSTEM AND METHOD |
| 摘要 |
A spinal implant includes an implant body including a first endplate and a second endplate. A plurality of electrodes include at least one electrode disposed with the first endplate and at least one electrode disposed with the second endplate such that the electrodes conduct an electric current to stimulate tissue growth adjacent the implant body. Systems, surgical instruments and methods are disclosed. |
| 申请公布号 |
US2017007420(A1) |
申请公布日期 |
2017.01.12 |
| 申请号 |
US201514792256 |
申请日期 |
2015.07.06 |
| 申请人 |
Warsaw Orthopedic, Inc. |
发明人 |
Stevenson Tyler S.;Benson Nicholas M.;Brown Richard L.;Bontemps Calvert S.;Metcalf Newton H.;Tyler Larry;Foley Kevin T.;Henschel Mark E.;Barror Michael W. |
| 分类号 |
A61F2/44;A61B5/00;A61F2/30;A61B5/07;A61N1/08;A61N1/05 |
主分类号 |
A61F2/44 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A spinal implant comprising:
an implant body including a first endplate and a second endplate; and a plurality of electrodes including at least one electrode disposed with the first endplate and at least one electrode disposed with the second endplate such that the electrodes conduct an electric current to stimulate tissue growth adjacent the implant body. |
| 地址 |
Warsaw IN US |
