EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE

摘要

An apparatus including a die; and a build-up carrier including alternating layers of conductive material and dielectric material disposed on a device side of the die and dielectric material embedding a portion of a thickness dimension of the die; and a plurality of carrier contact points disposed at a gradation between the device side of the die and the embedded thickness dimension of the die and configured for connecting the carrier to a substrate. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; forming a build-up carrier adjacent a device side of a die, wherein the build-up carrier includes a dielectric material defining a gradation between the device side of the die and a backside of the die, the gradation including a plurality of carrier contact points; and separating the die and the carrier from the sacrificial substrate.

主权项

1. A method comprising:
disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; forming a build-up carrier adjacent a device side of a die, wherein the build-up carrier comprises
a plurality of alternating layers of conductive material and dielectric material, anddielectric material embedding a portion of a thickness dimension of the die and defining a gradation between the device side of the die and a backside of the die, the gradation comprising a plurality of carrier contact points configured for mounting the build-up carrier to the substrate; and separating the die and the build-up carrier from the sacrificial substrate.