发明名称 PROCESS FOR PRODUCING COMPONENTS WITH PRESSURE-SENSITIVE ADHESIVE, AND COMPONENTS WITH PRESSURE-SENSITIVE ADHESIVE
摘要 Provided are a process for producing components equipped with a pressure-sensitive adhesive and components equipped with a pressure-sensitive adhesive which are produced by this process, the process comprising a printing step in which a pressure-sensitive adhesive 20 in the state of having no tackiness is applied by printing to at least some of the one surface of a substrate 1 on which components are to be formed, an ultraviolet irradiation step in which after the printing step, the substrate 1 is irradiated with ultraviolet light 2 to make the pressure-sensitive adhesive 20 have tackiness, a release paper application step in which release paper 3 is applied to the one surface of the substrate 1, and a shape pressing step in which the shape of each component is formed by punching. In the process, a pressure-sensitive adhesive is not applied separately to individual components but is adhered in advance to components which are to be punched out of the substrate. Hence, the pressure-sensitive adhesive can be adhered to a plurality of components after one positioning alignment, and the necessity of separately applying a double-faced pressure-sensitive adhesive tape to each component can be avoided, thereby heightening the productivity.
申请公布号 WO2017006957(A1) 申请公布日期 2017.01.12
申请号 WO2016JP69985 申请日期 2016.07.06
申请人 MELTEC CORPORATION 发明人 SOMA, Kenji
分类号 C09J7/02;G01D5/347 主分类号 C09J7/02
代理机构 代理人
主权项
地址