发明名称 LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME
摘要 A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.
申请公布号 US2017011854(A1) 申请公布日期 2017.01.12
申请号 US201615065521 申请日期 2016.03.09
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SON Soo Hwan;RA Seung Hyun;JUN Kyoung Jin;PARK Sang Soo;KIM Young Key;LEE Soon Ju
分类号 H01G4/38;H01G4/12;H05K1/11;H01G4/30;H05K1/18;H01G4/012;H01G4/228 主分类号 H01G4/38
代理机构 代理人
主权项 1. A laminated electronic component, comprising: a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body; and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor, wherein a current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.
地址 Suwon-si KR