发明名称 |
METHOD AND APPARATUS FOR FORMING INTERFACE BETWEEN COAXIAL CABLE AND CONNECTOR |
摘要 |
A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage; lowering the connector body and insulator onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; and applying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator. |
申请公布号 |
US2017012397(A1) |
申请公布日期 |
2017.01.12 |
申请号 |
US201615272671 |
申请日期 |
2016.09.22 |
申请人 |
CommScope Technologies LLC |
发明人 |
Paynter Jeffery D. |
分类号 |
H01R43/02;B23K1/00;B23K31/02;H01R4/02 |
主分类号 |
H01R43/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a solder joint between a coaxial cable and a coaxial connector, comprising the steps of:
positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage; lowering the connector body and insulator onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; and applying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator. |
地址 |
Hickory NC US |