METHOD OF MANUFACTURING BRAKE PEDAL COIL PRINTED CIRCUIT BOARD FOR VEHICLE

摘要

A method of manufacturing a brake pedal coil printed circuit board for vehicles is provided which is capable of allowing a wireless sensor to quickly sense whether physical energy from a driver is applied to a foot brake pedal to turn on rear brake lights. To solve the above problems, the method of manufacturing a brake pedal coil printed circuit board for vehicles includes preparing a first epoxy layer (100) having first copper foil (110) laminated on both surfaces thereof (S100), laminating each of second epoxy layers (200a and 200b) on the first copper foil (110), and laminating second copper foil (210) on each of the second epoxy layers (200a and 200b) (S200), forming a through hole (A) passing through upper and lower surfaces, performing electroless copper plating on an inside surface of the through hole (A) and the second copper foil (210), and forming an electrolytic copper-plated layer (220) on each of the electroless copper-plated layer (215) of the through hole (A) and the electroless copper-plated layer (215) formed on the second copper foil (210) (S300), forming circuits having a predetermined pattern on the electrolytic copper-plated layer (220) and the electroless copper-plated layer (215) and forming a gap between the circuits to have the same size as the circuits (S400), applying a PSR ink (250) onto the electrolytic copper-plated layer (220) (S500), applying a marking ink (260) onto the PSR ink (250) (S600), forming a nickel (Ni)-plated layer (230) around the through hole (A) and the hole land (S700), and forming an Au-plated layer (240) on the Ni-plated layer (230) (S800).

主权项

1. A method of manufacturing a brake pedal coil printed circuit board for vehicles, comprising:
preparing a first epoxy layer (100) having first copper foil (110) laminated on both surfaces thereof (S100); laminating each of second epoxy layer (200a and 200b) on the first copper foil (110), and laminating second copper foil (210) on each of the second epoxy layers (200a and 200b) (S200); forming a through hole (A) passing through upper and lower surfaces, performing electroless copper plating on an inside surface of the through hole (A) and the second copper foil (210), and forming an electrolytic copper-plated layer (220) on each of the electroless copper-plated layer (215) of the through hole (A) and the electroless copper-plated layer (215) formed on the second copper foil (210) (S300); forming circuits having a predetermined pattern on the electrolytic copper-plated layer (220) and the electroless copper-plated layer (215) and forming a gap between the circuits to have the same size as the circuits (S400); applying a PSR ink (250) onto the electrolytic copper-plated layer (220) excluding the through hole (A) and a hole land (S500); applying a marking ink (260) onto the PSR ink (250) (S600); forming a nickel (Ni)-plated layer (230) around the through hole (A) and the hole land (S700); and forming a gold (Au)-plated layer (240) on the Ni-plated layer (230) (S800), wherein, in S300, the electroless copper-plated layer (215) is formed to have a thickness of 1.3 μm to 1.7 μm by performing the electroless copper plating at a temperature of 40° C. (±2° C.) for 28 minutes in a plating solution which includes 82 g/L of copper sulfate, 155 g/L of ethylenediamine tetraacetic acid (EDTA), 32 mL/L of formaldehyde (HCHO), 42 g/L of sodium hydroxide (NaOH), 0.12 g/L of polyethylene glycol (PEG), and 83 mg/L of bipyridyl.